Samsung Secures Major AMD Deal for Next-Gen HBM Base Dies in New Texas Factory
Samsung Foundry has reportedly secured a significant commitment from AMD to produce next-generation High-Bandwidth Memory (HBM) base dies at its upcoming Taylor 2 facility in Texas. The new plant, twice the size of the first Taylor site, is set for commercial production by 2030 using Samsung’s 2nm process. This partnership marks a key milestone for Samsung as it seeks to strengthen its position in advanced semiconductor manufacturing amid competition with TSMC.
Samsung Foundry has reportedly secured a major commitment from AMD to produce next-generation High-Bandwidth Memory (HBM) base dies at its upcoming Taylor 2 fabrication facility in Taylor, Texas. The new plant, set to span 2.7 million square feet—about 1.5 times larger than the first Taylor site—is scheduled for commercial production by 2030 using Samsung’s advanced 2nm process. According to Maeil Business Newspaper, AMD is expected to occupy nearly all of Taylor Fab 2’s initial production capacity, signaling strong confidence in Samsung’s ability to deliver high-performance memory substrates. The facility will fabricate the logic base dies in Texas before bonding them with DRAM manufactured at Samsung’s domestic memory plants in South Korea, creating complete HBM assemblies. Ground preparation is already complete, with structural construction underway, and equipment installation is targeted for February 2029.
This development follows earlier reports of Samsung’s partnership with Tesla for its first Taylor site, marking a strategic shift toward high-margin semiconductor manufacturing. While AMD’s move is a significant win for Samsung in the race to challenge TSMC’s dominance in advanced nodes, it contrasts sharply with NVIDIA’s current strategy. The AI chipmaker has reportedly pushed its memory suppliers—including Samsung, SK hynix, and Micron—to standardize NVHBM base die production exclusively through TSMC, aiming to streamline validation and eliminate performance inconsis
This partnership could significantly reshape the high-performance computing supply chain, particularly in AI and data center markets where HBM is critical. If Samsung successfully delivers on its Texas-based production, it may reduce reliance on TSMC for advanced memory substrates, potentially increasing competition and pricing pressure in the semiconductor foundry sector. The move also underscores a broader trend of nearshoring and geopolitical diversification in chip manufacturing, as companies seek to mitigate risks associated with global supply chain disruptions. A comparable precedent is Intel’s recent push to expand domestic fabrication capacity amid U.S.-China tensions, though Samsung’s focus on high-end memory rather than logic chips represents a different strategic path. The outcome may influence how other tech giants evaluate foundry partnerships, especially as demand for AI accelerators grows. What remains uncertain is whether NVIDIA will reconsider its exclusive TSMC strate